Automotive Solutions

First choice for advanced automotive solutions

AT&S is Europe’s #1 Automotive PCB manufacturer with its headquarters in Austria and sales locations worldwide. Specific automotive qualifications of our facilities in China make us the preferred partner for the global automotive industry for

  • Anylayer,
  • mSAP, and
  • modules.

AT&S is THE reliable PCB and Substrate supplier in Japan with vast experience

For 17 years, AT&S has been a reliable partner for automotive customers and customers in various electronics segments in Japan. With offices in Tokyo and Kyoto we provide our customers with the latest interconnect technologies for tomorrow’s mobility. The local Japanese engineering and quality support allows AT&S to successfully conduct projects for leading OEMs from the concept phase to design-in to mass production.

Successful projects for the Automotive Industry

As global technology leader for high-end interconnect solutions, AT&S has built up competencies in the areas of V2X, ADAS, and infotainment. AT&S has developed and manufactured one of the first solutions for infotainment processing units (motherboard and interposer). Together with a leading German OEM, AT&S has been working on the world’s first Level III autonomous driving system, provides PCBs for the main board of the central computing system and has also been adopted for HVM.


Our core competencies:

  • V2X: leading supplier for Japanese, Korean and European customers
  • Worldwide one of the first solutions for infotainment processing units (motherboard and interposers)
  • Embedding: leading supplier for component embedding, system solutions and packaging

Innovation for tomorrow’s mobility

To stay at the edge of technology, AT&S strongly focuses on R&D activities in the areas of vehicle communication systems, infotainment boards and modules, trendsetting ADAS solutions, and 4D Radar systems for autonomous vehicles. This makes AT&S the Automotive partner for complex, forward-looking high-end interconnect solutions based on printed circuit boards and substrates with concepts towards modules.